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On-line Access: 2024-04-16
Received: 2022-12-21
Revision Accepted: 2023-06-13
Crosschecked: 2024-04-16
Cited: 0
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Citations: Bibtex RefMan EndNote GB/T7714
Prediction of undeformed chip thickness distribution and surface roughness in ultrasonic vibration grinding of inner hole of bearings
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Yanqin LI, Daohui XIANG, Guofu GAO, Feng JIAO, Bo ZHAO. Prediction of undeformed chip thickness distribution and surface roughness in ultrasonic vibration grinding of inner hole of bearings[J]. Journal of Zhejiang University Science A, 2024, 25(4): 311-323.
@article{title="Prediction of undeformed chip thickness distribution and surface roughness in ultrasonic vibration grinding of inner hole of bearings",
author="Yanqin LI, Daohui XIANG, Guofu GAO, Feng JIAO, Bo ZHAO",
journal="Journal of Zhejiang University Science A",
volume="25",
number="4",
pages="311-323",
year="2024",
publisher="Zhejiang University Press & Springer",
doi="10.1631/jzus.A2200609"
}
%0 Journal Article
%T Prediction of undeformed chip thickness distribution and surface roughness in ultrasonic vibration grinding of inner hole of bearings
%A Yanqin LI
%A Daohui XIANG
%A Guofu GAO
%A Feng JIAO
%A Bo ZHAO
%J Journal of Zhejiang University SCIENCE A
%V 25
%N 4
%P 311-323
%@ 1673-565X
%D 2024
%I Zhejiang University Press & Springer
%DOI 10.1631/jzus.A2200609
TY - JOUR
T1 - Prediction of undeformed chip thickness distribution and surface roughness in ultrasonic vibration grinding of inner hole of bearings
A1 - Yanqin LI
A1 - Daohui XIANG
A1 - Guofu GAO
A1 - Feng JIAO
A1 - Bo ZHAO
J0 - Journal of Zhejiang University Science A
VL - 25
IS - 4
SP - 311
EP - 323
%@ 1673-565X
Y1 - 2024
PB - Zhejiang University Press & Springer
ER -
DOI - 10.1631/jzus.A2200609
Abstract: ultrasonic vibration grinding differs from traditional grinding in terms of its material removal mechanism. The randomness of grain–workpiece interaction in ultrasonic vibration grinding can produce variable chips and impact the surface roughness of workpiece. However, previous studies used iterative method to calculate the unformed chip thickness (UCT), which has low computational efficiency. In this study, a symbolic difference method is proposed to calculate the UCT. The UCT distributions are obtained to describe the stochastic interaction characteristics of ultrasonic grinding process. Meanwhile, the UCT distribution characteristics under different machining parameters are analyzed. Then, a surface roughness prediction model is established based on the UCT distribution. Finally, the correctness of the model is verified by experiments. This study provides a quick and accurate method for predicting surface roughness in longitudinal ultrasonic vibration grinding.
[1]AgarwalS, Venkateswara RaoP, 2005. A probabilistic approach to predict surface roughness in ceramic grinding. International Journal of Machine Tools and Manufacture, 45(6):609-616.
[2]AgarwalS, Venkateswara RaoP, 2010. Modeling and prediction of surface roughness in ceramic grinding. International Journal of Machine Tools and Manufacture, 50(12):1065-1076.
[3]AgarwalS, Venkateswara RaoP, 2013. Predictive modeling of force and power based on a new analytical undeformed chip thickness model in ceramic grinding. International Journal of Machine Tools and Manufacture, 65:68-78.
[4]ChenFJ, YinSH, HuangH, et al., 2010. Profile error compensation in ultra-precision grinding of aspheric surfaces with on-machine measurement. International Journal of Machine Tools and Manufacture, 50(5):480-486.
[5]ChenHF, TangJY, ZhouW, 2013. Modeling and predicting of surface roughness for generating grinding gear. Journal of Materials Processing Technology, 213(5):717-721.
[6]ChenHF, TangJY, DengZH, et al., 2018. Modeling and predicting surface topography of the ultrasonic assisted grinding process considering ploughing action. Journal of Mechanical Engineering, 54(21):231-240 (in Chinese).
[7]DarafonA, WarkentinA, BauerR, 2013. 3D metal removal simulation to determine uncut chip thickness, contact length, and surface finish in grinding. The International Journal of Advanced Manufacturing Technology, 66(9-12):1715-1724.
[8]DingWF, DaiCW, YuTY, et al., 2017. Grinding performance of textured monolayer CBN wheels: undeformed chip thickness nonuniformity modeling and ground surface topography prediction. International Journal of Machine Tools and Manufacture, 122:66-80.
[9]DingWF, CaoY, ZhaoB, et al., 2022. Research status and future prospects of ultrasonic vibration-assisted grinding technology and equipment. Journal of Mechanical Engineering, 58(9):244-269 (in Chinese).
[10]GongYD, WangB, WangWS, 2002. The simulation of grinding wheels and ground surface roughness based on virtual reality technology. Journal of Materials Processing Technology, 129(1-3):123-126.
[11]HeYH, WanRQ, ZhouJJ, et al., 2017. Modeling for surface roughness of hard and brittle materials in axial ultrasonic vibration grinding. Journal of Vibration and Shock, 36(23):194-200 (in Chinese).
[12]HeckerRL, LiangSY, 2003. Predictive modeling of surface roughness in grinding. International Journal of Machine Tools and Manufacture, 43(8):755-761.
[13]MalkinS, GuoCS, 2008. Grinding Technology: Theory and Applications of Machining with Abrasives, 2nd Edition. Industrial Press, New York, USA, p.115-156.
[14]SettiD, ArrabiyehPA, KirschB, et al., 2020. Analytical and experimental investigations on the mechanisms of surface generation in micro grinding. International Journal of Machine Tools and Manufacture, 149:103489.
[15]TaoHF, LiuYH, ZhaoDW, et al., 2022. Undeformed chip width non-uniformity modeling and surface roughness prediction in wafer self-rotational grinding process. Tribology International, 171:107547.
[16]WangQY, LiangZQ, WangXB, et al., 2017. Research on modeling and simulation of surface microtopography in ultrasonic vibration spiral grinding. Journal of Mechanical Engineering, 53(19):83-89 (in Chinese).
[17]WangQY, LiangZQ, WangXB, et al., 2020. Modelling and analysis of generation mechanism of micro-surface topography during elliptical ultrasonic assisted grinding. Journal of Materials Processing Technology, 279:116585.
[18]YangZC, ZhuLD, ZhangGX, et al., 2020. Review of ultrasonic vibration-assisted machining in advanced materials. International Journal of Machine Tools and Manufacture, 156:103594.
[19]ZhangK, YinZ, DaiCW, et al., 2022. Undeformed chip thickness characteristics in grain-workpiece contact zone in ultrasonic vibration assisted grinding. Diamond & Abrasives Engineering, 42(1):88-96 (in Chinese).
[20]ZhangXF, YangL, WangY, et al., 2020. Mechanism study on ultrasonic vibration assisted face grinding of hard and brittle materials. Journal of Manufacturing Processes, 50:520-527.
[21]ZhangYZ, FangCF, HuangGQ, et al., 2018. Modeling and simulation of the distribution of undeformed chip thicknesses in surface grinding. International Journal of Machine Tools and Manufacture, 127:14-27.
[22]ZhouWH, TangJY, ChenHF, et al., 2018. A comprehensive investigation of plowing and grain-workpiece micro interactions on 3D ground surface topography. International Journal of Mechanical Sciences, 144:639-653.
[23]ZhouWH, TangJY, ChenHF, et al., 2019. A comprehensive investigation of surface generation and material removal characteristics in ultrasonic vibration assisted grinding. International Journal of Mechanical Sciences, 156:14-30.
[24]ZhouX, XiF, 2002. Modeling and predicting surface roughness of the grinding process. International Journal of Machine Tools and Manufacture, 42(8):969-977. https://doi.org /10.1016/S0890-6955(02)00011-1
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